透透ガラス (TGV) ガラス

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May 31, 2024
カテゴリー接続: サファイアの基質
概要: Discover the innovative Through-Glass Vias (TGV) technology for JGS1, JGS2, sapphire, and Corning glass, designed for sensor manufacturing and packaging. Enhance performance and reliability in automotive, aerospace, medical, and consumer electronics with our advanced TGV solutions.
関連製品特性:
  • Enables device miniaturization with compact interconnect solutions.
  • Supports anodic bonding with silicon wafers, eliminating out-gassing issues.
  • Superior high-frequency characteristics ideal for RF applications.
  • Precise via pitch tolerance of less than ±20μm per 200mm wafer.
  • 直径200mmまでのワッフルに適しています
  • Laser-induced etching ensures crack-free blind and through vias.
  • High aspect ratios and high-density vias for modern technology demands.
  • Widely used in high-performance computing, 5G, IoT, and sensor packaging.
FAQ:
  • What is Through Glass Via (TGV) technology?
    TGV technology is a microfabrication technique for creating vertical electrical connections through glass substrates, essential for advanced electronic packaging and high-density integration.
  • 半導体におけるTGVの用途は?
    半導体において、TGV技術は、5G、IoT、センサーパッケージングなどの用途で、高密度集積、高周波性能、および熱的・機械的安定性の向上に利用されています。
  • What materials are compatible with TGV technology?
    TGV technology is compatible with premium materials such as JGS1, JGS2, sapphire, and Corning glass, making it versatile for various high-performance applications.