Name: シリウム/サファイア/超硬質の脆い材料のための多線ダイヤモンドの切断システム
Uploaded: 2026-02-25CST01:08:39-06:00
Duration: 17 s
Description: Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.

チャットお問い合わせ

シリウム/サファイア/超硬質の脆い材料のための多線ダイヤモンドの切断システム

他のビデオ

August 18, 2025

キーワード: 科学的な実験装置

チャットお問い合わせ

タグ:

#紫外線伝送のメートル #軽い伝送のメートル #光通信のメートル

ビデオ説明:

Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.