Name: シリウム/サファイア/超硬質の脆い材料のための多線ダイヤモンドの切断システム
Uploaded: 2026-02-06CST00:12:12-06:00
Duration: 17 s
Description: Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.

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シリウム/サファイア/超硬質の脆い材料のための多線ダイヤモンドの切断システム

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August 18, 2025

Keyword: 科学的な実験装置

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#紫外線伝送のメートル #軽い伝送のメートル #光通信のメートル

Video Description:

Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.