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半導体・ウェーファー加工のためにマイクロ流体レーザー機器を選択する理由を見る

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December 16, 2025
カテゴリー接続: 科学的な実験装置
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タグ:
#紫外線伝送のメートル #軽い伝送のメートル #光通信のメートル
概要: このウォークスルーでは デザインの重要なアイデアや その成果を表現する方法について お話ししますマイクロ流体レーザー機器が半導体ウェーファー加工のためにレーザーエネルギーを導くために髪の薄い水噴射を使用する方法を見てくださいこのハイブリッドマイクロ機械方法が熱損傷を軽減し,汚染を防止し,SiCとGaNのウエファーのような硬くて脆い材料の縁質を向上させる方法を発見します.
関連製品特性:
  • Hybrid micromachining method coupling a thin water jet with a laser beam for precise energy delivery.
  • Total internal reflection guiding mechanism ensures accurate laser beam transmission to the workpiece.
  • Continuous cooling and debris removal during processing for a cleaner, more stable operation.
  • Reduces heat-affected damage, contamination, oxidation, and microcracks in semiconductor materials.
  • Supports various laser wavelengths (1064 nm, 532 nm, 355 nm) and power levels up to 200 W.
  • Configurable nozzle diameters from 30-150 μm using sapphire or diamond materials.
  • High-precision positioning with accuracy up to ±5 μm and repeatability of ±2 μm.
  • Applicable to advanced packaging, wafer dicing, chip drilling, and defect repair processes.
FAQ:
  • What is microjet laser technology?
    Microjet laser technology is a hybrid micromachining process where a thin, high-velocity water jet guides a laser beam using total internal reflection, delivering precise energy to the workpiece while providing continuous cooling and debris removal.
  • What are the key advantages of microjet laser processing versus dry laser processing?
    Key advantages include reduced heat-affected damage, less contamination and redeposition, lower risk of oxidation and microcracks, minimized kerf taper, and improved edge quality on hard and brittle semiconductor materials.
  • Which semiconductor materials are best suited for microjet laser processing?
    It is particularly well-suited for hard and brittle materials like silicon carbide (SiC) and gallium nitride (GaN), as well as silicon wafers, ultra-wide-bandgap materials such as diamond and gallium oxide, and selected advanced ceramic substrates.
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